Numerical models can provide data from an enormous number of points and for a number of human simulants. Alastair R. Ruddle, Ph.D. MIRA Limited, Nuneaton, UK On-board transmitters are already commonly encountered in the vehicle environment: typical examples include mobile telephones, Bluetooth systems, and communications equipment used by the emergency services and armed … [Read more...]
Test Beyond the Specs: Why Test Higher in Frequency and Field Strength?
IEC 61000-4-3: 2006's frequency escalation Jason Smith and Pat Malloy AR RF/Microwave Instrumentation, Souderton, PA, USA An increasing number of new and proposed EMC standards are pushing the upper frequency test limits higher into the microwave spectrum. The latest EMC standard released, IEC 61000-4-3: 2006, is no exception. The upper frequency test limit has been increased … [Read more...]
Don’t Settle for Being Just an E3 Engineer—Become an E3 Advocate!
INTRODUCTION It is often the accepted practice for the E3 engineer on a program simply to provide his technical expertise on meeting EMI, EMC, EMP and other E3 requirements and to let others take the recommendations from there. Once the analysis and recommendations are complete, the decisions on how to implement the design are up to the platform design team. The truth be … [Read more...]
Towards an EMC Technology Roadmap
A technology roadmap is a tool for attaining the optimum development within a sector of technology. Marcel van Doorn Philips Electromagnetics & Cooling Competence Center, Eindhoven, the Netherlands INTRODUCTION This article expands earlier work on the concept of a technology roadmap for EMC technology.1 Just as a traditional terrestrial map helps insure that travelers … [Read more...]
New EMC Directive: 2004/1081 EC
Manufacturers should familiarize themselves with the additional requirements and the alterations found in the new EMC directive Manjula Bhati Electronics Regional Test Laboratory (West), Indian Ministry of Information Technology, Mumbai, India The current EMC directive 89/336/EEC, which was first published in 1989 and then succeeded by four amendments has been rewritten as … [Read more...]
An Emission Measurement System for the Twenty-First Century Based on Time-Domain Measuring Methods
More information and reduced measurement time can significantly improve the quality of emissions testing. Stephan Braun and Peter Russer Institute for High Frequency Engineering, Munich University of Technology, Munich, Germany For some time, measurements of electromagnetic interference have been carried out by super-heterodyne receivers operating in the frequency domain. … [Read more...]
Aussie Researcher Says Managing Crosstalk Will Speed DSL
Dr. John Papandriopoulos, an Australian researcher, has announced a technique to boost broadband speeds on ordinary DSL lines by up to ten times. The Ph.D. thesis Papandriopoulos wrote at the University of Melbourne outlines an algorithm that reduces crosstalk interference on copper phone lines. Dr. Papandriopoulos will soon join the staff of Silicon Valley-based ASSIA founded … [Read more...]
Shielding Effectiveness of Gaskets, Composites and Shields
There is an ever-increasing demand for lighter, stronger, easy-to-manufacture and cost-effective shielding solutions. Jack Prawica and Jereme Irwin DLS Electronic Systems, Inc., Wheeling, IL, USA As we move into the 21st century, there is a demand for stronger, lighter, less expensive, and environmentally friendly, RoHS-compliant* conductive materials. Many industry insiders … [Read more...]
Line of Custom Filters Targets Multiple Applications
A line of custom EMI filters offered by Electrocube provides solutions for unique filter requirements. Complete design engineering and testing capabilities are provided to customers in the military, industrial, electronic, and aerospace industries. Electrocube filters have current carrying capacities of 0.1 amp to 500 amps; voltage ratings of 1 VDC to 5000 VDC; frequencies to … [Read more...]
Thermal and EMI Shielding Boost Design Reliability
Optimal shielding helps meet the challenges of cramming maximum functionality into minimal PCB space. Paul J. Stus Laird Technologies, St. Louis, MO, USA Advances in the miniaturization of electronic components has intensified the need for manufacturers to solve multiple problems simultaneously and earlier in the design process. Solving the issues quickly and early in … [Read more...]
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