In today’s landscape of electromagnetic field (EMF) measurements, ensuring the proper operation of measurement instruments quickly and directly in the field represents a major advantage for technicians. The growth of wireless applications, the expansion of broadband networks, and the need for compliance with international standards have made it essential to have … [Read more...]
KRYTAR Announces New Compact 3 dB, 180-Degree Hybrid Coupler Covering 7.125 to 15.35 GHz
FOR IMMEDIATE RELEASE KRYTAR Announces New Compact 3 dB, 180-Degree Hybrid Coupler Covering 7.125 to 15.35 GHz NOVEMBER 11, 2025, SUNNYVALE, CALIF. — KRYTAR, Inc., a leader in the design and production of ultra-broadband microwave components and test equipment announces a new 180-Degree Hybrid Coupler that delivers 3 dB of coupling over the frequency … [Read more...]
You Measured What? 4 Must-Know Checks for Trusting Your S-Parameters
Verifying your trace S-parameters is more than just good practice—it’s essential for confident measurement, simulation, and design space exploration in modern EDA tools. Especially in high-speed digital systems where traces are long, applying a few key principles can provide valuable insights into your data and give you a head start in your design … [Read more...]
Waveguide Insights: Understanding Rectangular and Double-Ridge Designs for Enhanced RF Systems
OVERVIEW This App-Note provides a thorough examination of rectangular and double-ridge waveguides, highlighting their design, operating principles, advantages, and applications. It details specifications and power-handling considerations essential for RF systems. Waveguides are crucial in microwave engineering, offering low-loss, high-efficiency transmission for … [Read more...]
PPI Announces New Broadband Conical Inductors – Up to 110 GHz
Huntington, New York – August 2025 Passive Plus (PPI) has announced a new line of Broadband Conical Inductors for bias T’s, broadband chip manufacturing, communication platforms, high frequency, microwave circuitry, RF test set-ups, test & measurement, test gear, test instrumentation and transmission amplifiers. These special RF chokes are used to filter RF and … [Read more...]
Myths and Legends of EMI in PCB Design
Many designers struggle with EMI and EMC challenges, and there are many myths surrounding EMI that do not help designers overcome EMC hurdles. Some designers may lack experience, while others may know EMI/EMC rules but apply them incorrectly. There is also an issue of delegation, where EMI/EMC is sometimes seen as not being a designer’s problem. No matter who is … [Read more...]
IoT Systems with mmWave Sensors
One of the most common applications of Internet of Things (IoT) devices is sensing, followed by transmission of raw data back to a base station or server for storage and further analysis. The most common of these sensing tasks seems to be environmental sensing, such as monitoring gas concentrations, temperature, humidity, etc. These devices are so ubiquitous that they … [Read more...]
Regulatory Lunch Break: Alphabet Soup
Over several decades, the FCC, the US Trade Representative, Department of Commerce (NIST) and the Industry (TCB Council, ACIL, Private Labs, including WLL) have been involved with opening up regulatory trade arrangements under the guise of “Mutual Recognition Arrangements” (MRAs). The purpose of MRAs is to even the playing ground for labs and their industrial clientele. In the … [Read more...]
Skip-Layer Routing for High Bandwidth Channels
As we have seen from discussions on chiplets and their routing standards in substrates, many of the routing techniques used in PCBs also apply in packaging. Microstrip and stripline structures can both be used in IC substrates, and the design approach is basically the same as in PCBs. This routing is fine for the majority of digital interfaces, but when we get to wideband … [Read more...]
Navigating Signal Integrity in Chiplet Designs
As the semiconductor industry embraces the chiplet design approach, electrical engineers are witnessing a significant shift in how performance, cost efficiency, and scalability are achieved. While this modular design philosophy offers advantages, it also introduces challenges to signal integrity (SI). For EMI/EMC engineers, the awareness of these signal integrity challenges is … [Read more...]
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