When Two TDRs Don’t Agree As modern high-speed designs push into multi-gigabit and higher data rates, EMI and EMC engineers rely on multiple signal integrity (SI) metrics to evaluate interconnect performance. Among these, time-domain reflectometry (TDR) remains one of the most direct methods for identifying controlled impedance and … [Read more...]
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You Measured What? 4 Must-Know Checks for Trusting Your S-Parameters
Verifying your trace S-parameters is more than just good practice—it’s essential for confident measurement, simulation, and design space exploration in modern EDA tools. Especially in high-speed digital systems where traces are long, applying a few key principles can provide valuable insights into your data and give you a head start in your design … [Read more...]
Navigating Signal Integrity in Chiplet Designs
As the semiconductor industry embraces the chiplet design approach, electrical engineers are witnessing a significant shift in how performance, cost efficiency, and scalability are achieved. While this modular design philosophy offers advantages, it also introduces challenges to signal integrity (SI). For EMI/EMC engineers, the awareness of these signal integrity challenges is … [Read more...]
