Overview: Microvia (High Density Interconnect, HDI) PCB manufacturing technology has developed rapidly in recent years, and can now be used to reduce bare-board cost where a Through Hole Plate (THP) board would need 10 or more layers.
And microvia’s benefits for good EMC (and SI and PI) design at board level mean it can reduce overall unit-cost-of-manufacture even where THP boards would require fewer than 10 layers.
This webinar looks at what microvia board techniques are now available, and how they can be used to help achieve good EMC whilst reducing costs and getting to market more quickly.
Speaker: Keith Armstrong
Keith Armstrong graduated with honors from Imperial College London in 1972 with a B.S. in Electrical Engineering, specializing in analogue circuit design and electromagnetic field theory.
Between 1972 and 1990 he worked for a variety of electronics companies, as electronic designer, then project manager and design manager. In 1990 he went independent with Cherry Clough Consultants Ltd, providing design services to help achieve compliance with EMC, and with Safety, whilst at the same time helping to reduce time-to-market, design costs, unit manufacturing costs, and warranty costs. Now, in 2012, Cherry Clough has had nearly 800 satisfied customers in almost all areas where electronics are used.
Additional achievements of Keith Armstrong include: Chartered Electrical Engineer (UK) since 1978 Group 1 European Engineer since 1988 Past Chairman of IEE’s Professional Group (E2) on EMC Member of IEE’s EMC & Product Safety Societies Chairman of IEE’s Working Group on EMC & Functional Safety UK expert appointed to IEC 61000-1-2 maintenance team Numerous publications on EMC for Functional Safety UK expert appointed to IEC 61000-6-7 maintenance team UK expert appointed to IEC 60601-1-2 maintenance team (medical device EMC) Published numerous articles, presented many papers, and published three textbooks, on good, cost-effective EMC design practices for everything from circuits through PCBs to products, systems and installations of any size, whether static or mobile.