The Molex Incorporated enhanced zSFP+ (Small Form-factor Pluggable Plus) Surface Mount Technology 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect assemblies are scalable for next-generation applications and provide optimal electromagnetic interference (EMI) and signal integrity (SI) margins in 10 and 16 Gbps channels.Learn more from Molex.
SMT 20-Circuit Interconnect Solution for 25 Gbps Data and Telecom

The Molex Incorporated enhanced zSFP+ (Small Form-factor Pluggable Plus) Surface Mount Technology 20-circuit connectors deliver superior performance in high-speed telecom and data communications equipment. Designed for 25 Gbps serial channels in high-speed Ethernet and Fibre Channel, the new zSFP+ interconnect assemblies are scalable for next-generation applications and provide optimal electromagnetic interference (EMI) and signal integrity (SI) margins in 10 and 16 Gbps channels.Learn more from Molex.


