The ESD11N and the ESD11B from ON Semiconductor are two electrostatic discharge (ESD) protection devices housed in its new, ultra-small 0201 Dual Silicon No-Lead (DSN-2) package. The DSN style package, which measures a mere 0.6 mm x 0.3 mm x 0.3 mm, enables 100 percent utilization of the package area for active silicon, offering a significant performance-per-board-area advantage compared with products in plastic molded packages. The ESD11N is a 0.6-pF device that utilizes patented integrated ESD technology from ON Semiconductor which enhances clamping performance while maintaining low capacitance. The low capacitance value ensures that this device has negligible impact on the signal integrity of high speed data lines making it ideal for applications such as USB2.0 and HDMI. In addition, the ESD11N maintains less than 0.5 decibel (dB) insertion loss up to 3 gigahertz (GHz) and excellent capacitance linearity over voltage and frequency making it suitable for protecting high frequency antenna lines with minimal effects. The ESD11B is a 15 pF device that expands ON Semiconductor low clamping ESD protection technology into the new 0201 DSN-2 package to provide a protection option for general purpose and low speed data lines that have tight board designs with limited room.Find more product information at the On Semiconductor website.