For EMI / EMC Engineers
EDI CON 2015 – Electronic Design Innovation Conference
April 14-16, 2015
Beijing, China
The 3rd annual Electronic Design Innovation Conference (EDI CON) is now accepting papers related to all aspects of RF, microwave, EMI/EMC and high speed digital design for presentation during this premier three day event. Authors are requested to submit a draft paper or comprehensive abstract that provides sufficient detail about the proposed paper.
Submission Deadline Extended to November 30, 2014.
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