A new Class D amplifier offers more output power, lower noise and purportedly unsurpassed EMI performance in the industry’s smallest package. Maxim’s new amplifier’s 0.3mm-pitch, 9-bump wafer-level package (WLP) features a no-connect middle bump to eliminate the need for expensive PCB technologies. This allows the use of single-layer PCBs for reduced manufacturing cost. The MAX98304 is well suited for cell phones, tablets, e-readers, notebooks, and netbooks.Learn more from Maxim.
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Interference Technology
Established in 1970, Interference Technology helps EMI/EMC engineers find solutions to their various testing, design, application and regulatory issues by publishing articles, news and other practical content. We help suppliers in these areas to find the right customers for their components, materials, test equipment and services through a wide range of marketing services, including lead generation, branding, market research and events. The publication is available in various printed and electronic media formats, with readers in over 60 countries. We also publish issues in local languages in China, Japan and Europe.