Tyco Electronics has expanded its silicon ESD protection product portfolio with the introduction of 0201- and 0402-size devices that are easier to install and rework than traditional semiconductor-packaged ESD devices. The SESD0201P1BN-0400-090 (0201 package) and SESD0402P1BN-0450-090 (0402 package) devices’ bi-directional operation facilitates placement on the printed circuit board (PCB) without orientation constraints and eliminates the need for polarity inspection. Unlike conventional ESD diode packaging using pads on the bottom of the device, the ChipSESD device’s passive package also allows for easy solder inspection after the device has been mounted on the PCB.Learn more from Tyco.
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Interference Technology
Established in 1970, Interference Technology helps EMI/EMC engineers find solutions to their various testing, design, application and regulatory issues by publishing articles, news and other practical content. We help suppliers in these areas to find the right customers for their components, materials, test equipment and services through a wide range of marketing services, including lead generation, branding, market research and events. The publication is available in various printed and electronic media formats, with readers in over 60 countries. We also publish issues in local languages in China, Japan and Europe.