Tyco Electronics has expanded its silicon ESD protection product portfolio with the introduction of 0201- and 0402-size devices that are easier to install and rework than traditional semiconductor-packaged ESD devices. The SESD0201P1BN-0400-090 (0201 package) and SESD0402P1BN-0450-090 (0402 package) devices’ bi-directional operation facilitates placement on the printed circuit board (PCB) without orientation constraints and eliminates the need for polarity inspection. Unlike conventional ESD diode packaging using pads on the bottom of the device, the ChipSESD device’s passive package also allows for easy solder inspection after the device has been mounted on the PCB.Learn more from Tyco.
Bi-Directional, Silicon-Based ESD Protection Devices
