Give a Talk at EDI CON!
Here’s your chance to share your expertise, explain an often misunderstood technical point, or share your latest research with engineers working on RF, microwave, and/or high-speed digital designs. EDI CON USA 2018 uniquely brings together engineers, designers, and systems integrators working on analog as well as digital designs in a conference and exhibition at the Santa Clara Convention Center, Santa Clara, CA Oct 17-19. Join the best of the best of industry experts, speak to your colleagues and peers, and help solve nextgeneration technical issues.
If your abstract is accepted by the EDI CON USA Technical Advisory Committee, you will receive free conference admission ($599 value- including all-day training at EDI CON University on October 19th, as well as networking opportunities), and be eligible for an Outstanding Paper Award and online publication in Microwave Journal and/or Signal Integrity Journal.
2018 Conference Chairs: Jin Bains, Head of Connectivity, SCL, at Facebook & Ransom Stephens, Ph.D., author, technologist, and physicist.
Conference Highlights: Tutorials, Keynotes, Short Courses, Technical Sessions, Workshops, Speed Training, and Panel Sessions as well as product demonstrations on the Exhibition Floor.
SUBMIT AN ABSTRACT (DEADLINE MAY 3):
