Printed circuit board (PCB) and integrated circuit (IC) package design engineers can now download a simulated model of Embedded Capacitance Materials (ECM) from 3M for use in HFSS™ and SIwave™ engineering simulation software. Part of the Ansoft family of products from ANSYS, Inc. (NASDAQ: ANSS), HFSS and SIwave technologies enable design engineers to perform complete signal- and power-integrity analyses from DC to beyond 10 Gbps on PCBs and IC packages. The availability of 3M ECM in the HFSS and SIwave programs means that design engineers can better address their noise issues early in the design cycle by incorporating the material into their design simulations, resulting in improved performance with fewer design spins.Learn more from 3M.
3M Embedded Capacitance Material Now Available in HFSS and SIwave
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