Building accurate electrical models and predicting the interconnect performance are increasingly challenging for present and future high speed signaling where a few pico-seconds or mili-volts of error are no longer considered “negligible”. This Special Session will address this issue by focusing on multi-Gbps interconnect simulation and measurement for signal integrity and EMI optimization.Planned Papers1. Mode Conversion Effects in Multi-Gbps Telecommunications Blade SystemGreg Pitner; Ansoft LLC; Austin, TX, U.S.A.Daniel de Araujo; Ansoft LLC; Austin, TX, U.S.A.Minhong Mi; Ansoft LLC; Austin, TX, U.S.A.Bhyrav Mutnury; IBM Systems and Technology Group; Austin, TX, U.S.A.Moises Cases; IBM Systems and Technology Group; Austin, TX, U.S.A.Nam Pham; IBM Systems and Technology Group; Austin, TX, U.S.A.2. Efficient methodologies to study the signal integrity of multi Gb/s interconnects and full system EMCA. Ciccomancini Scogna; CST of America, Inc.; Framingham, MA, U.S.A.D. Johns; CST of America, Inc.; Framingham, MA, U.S.A.3. Material Parameter Extraction Using Time Domain TRL(t-TRL) MeasurementsAbhilash Rajagopal; Cisco Systems, Inc.; San Jose, CA, U.S.A.Brice Achkir; Cisco Systems, Inc.; San Jose, CA, U.S.A.Marina Koledintseva; Missouri University of Science and Technology; Rolla, MO, U.S.A.James Drewniak; Missouri University of Science and Technology; Rolla, MO, U.S.A.4. Serial Link Engineering: Current Methodologies and Future TrendsKumar Keshavan; Sigrity, Inc; Santa Clara, CA, U.S.A.Tariq Abou-Jeyab; Sigrity, Inc; Santa Clara, CA, U.S.A.5. Building Accurate Spice Models for Multi-Gbps Interconnect in Computer SystemsXiaoning Ye; Intel Corporation; Hillsboro, OR, U.S.A.Kai Xiao; Intel Corporation; Dupont, WA, U.S.A.Chung-chi Huang; Intel Corporation; Hillsboro, OR, U.S.A.
Special & Invited Sessions – Multi-Gbps Interconnect Simulation and Measurement for Signal Integrity and EMI
