A new line of soft termination multi-layer chip capacitors from TDK Corporation offers improved thermal and mechanical strength. To address reliability of C1005 (CC0402) through C3225 (CC210) case sizes, TDK has developed a four-layer termination structure. This new product adds a conductive resin layer between the copper base material and the nickel plating layer. Although the 100-hundred percent matte Sn termination finish is compatible with Pb solder systems, the soft-termination MLCC features are particularly useful when used with Pb-free solder. Temperature cycling performance of these soft termination devices is reported to be three times that of standard devices. Also, they are said to withstand board bend stress with no change in capacitance.Find more product information of the TDK Corporation website.
Soft Termination Capacitors Boost Reliability
