The U.S. Patent and Trademark Office has awarded patent No. 8,536,684, “Method of Assembling Shielded Integrated Circuit Device,” to Freescale Semiconductor, Inc. of Austin, Texas.
According to the background information supplied by the inventors, the new patent covers “A method of assembling an integrated circuit (IC) device, which includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method [includes] encapsulating the die with a first encapsulant, then encapsulating the first encapsulant with a second encapsulant. The second encapsulant includes a material that provides electromagnetic shielding.”
