A new range of surface mount EMI/RFI shield clips from UK-based interconnect company Harwin help reduce assembly time and simplify rework by eliminating secondary soldering operations. Unlike conventional EMI/RFI shields that must be hand-soldered to the board, these new shield clips are supplied in industry-standard tape-and-reel packaging and can be soldered using standard SMT placement equipment. The shielding can is then simply pushed into place during final assembly. Because it is possible to remove and to refit the can a number of times, adjustment and rework operations are simplified. Consequently, both initial production and rework costs are significantly reduced.RFI clips are available in two sizes. The larger midi clip can handle cans with a wall thickness of 0.3 mm and is available in beryllium copper and beryllium-free copper. The smaller mini version is available only in beryllium copper and suits cans wall thicknesses of 0.13 to 0.23 mm. These EMI/RFI clips are targeted at telecommunications, data-communications, data-processing, and in-vehicle communications. Learn more at the Harwin website.Shielding board level components is an ongoing design challenge. Keep up with the latest development s in EMI/RFI shielding. Just go to the Interference Technology Shielding Channel.
New Surface Mount RFI Clips Speed Product Assembly Time
