Cree, Inc. has released an all-SiC power module. The 1.7kV Power Module in an industry standard 62mm housing has lower production costs, smaller size, and lighter weight than typical products. The module also has a 10-times higher switching efficiency and 8mOhm on-resistance efficiency.
The switching efficiency and voltage capability of the new module enables simplified two-level topologies that are feasible at higher frequencies, eliminating the need to invest in complex, multi-level silicon-based solutions, according to the company. The high power density that can be achieved with the newest half-bridge module that further simplifies the implementation of modular system designs and enables extremely low mean time to repair for high overall system availability.
“By utilizing our state-of-the-art SiC technology, Cree’s power module portfolio enables higher efficiency, improved reliability and lower total cost of ownership,” Cengiz Balkas, general manager and vice president of Cree Power and RF, said.