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EMI Solutions for Higher Cycling, Packing Densities and Environmental Treads

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Laird Technologies will be exhibiting a number of EMI solutions that address changing issues in the EMC field, such as higher cycling, packing densities and environmental treads at the 2012 EMC Symposium in Pittsburgh, PA. The company will showcase elastomers and Fabric-over-Foam solutions including EcoShear and hybrid tape products. Laird Technologies will also showcase new board-level shielding solutions, such as the ReMovl™ product enhancement and the Rigid Corner Board Level Shield Enhancement.

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Interference Technology

Established in 1970, Interference Technology helps EMI/EMC engineers find solutions to their various testing, design, application and regulatory issues by publishing articles, news and other practical content. We help suppliers in these areas to find the right customers for their components, materials, test equipment and services through a wide range of marketing services, including lead generation, branding, market research and events. The publication is available in various printed and electronic media formats, with readers in over 60 countries. We also publish issues in local languages in China, Japan and Europe.

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