Sponsor

EMI Solutions Exhibit Addresses Changing Issues in EMC Field

August 5, 2013 Interference Technology Conductive Materials, Products, Shielding

Laird Technologies will be exhibiting EMI solutions at the 2013 IEEE International Symposium on EMC, including performance coatings, SMD grounding contacts, elastomers and EMI tape.

According to the company, these solutions address the changing issues in the EMC field, including higher cycling, packing densities and environmental trends.

Also on display will be ECCOSORB MF-Thermoplast absorbers. Manufactured through injection molding, these absorbers are ideal solutions for complex three-dimensional parts and are adaptable to high volume manufacturing.

About the Author

Interference Technology

Established in 1970, Interference Technology helps EMI/EMC engineers find solutions to their various testing, design, application and regulatory issues by publishing articles, news and other practical content. We help suppliers in these areas to find the right customers for their components, materials, test equipment and services through a wide range of marketing services, including lead generation, branding, market research and events. The publication is available in various printed and electronic media formats, with readers in over 60 countries. We also publish issues in local languages in China, Japan and Europe.