A new Class D amplifier offers more output power, lower noise and purportedly unsurpassed EMI performance in the industry’s smallest package. Maxim’s new amplifier’s 0.3mm-pitch, 9-bump wafer-level package (WLP) features a no-connect middle bump to eliminate the need for expensive PCB technologies. This allows the use of single-layer PCBs for reduced manufacturing cost. The MAX98304 is well suited for cell phones, tablets, e-readers, notebooks, and netbooks.Learn more from Maxim.