Now available from UK passive component manufacturer, Syfer Technology, is a range of SMD low-pass, band-pass, high-pass and band-stop filters for frequencies up to 6GHz. Designed to meet increased integration demands in the burgeoning RF and microwave sectors for wireless communications systems, these filters offer significant performance, space and cost advantages. They are … [Read more...]
Technical Program Co-Chairs’ Message
The 2009 Austin Technical Program has something for everyone — from the novice EMC engineer to the advanced practitioner. There are four components to the Technical Program; the regular sessions of technical papers, a series of Special Sessions and invited papers, an array of Workshops and Tutorials, and the Hardware Experiment Demonstrations and Computer Modeling & … [Read more...]
Technical Paper Sessions
Approximately 160 regular technical papers and approximately 30 Special Session papers are expected to be presented at EMC 2009 in Austin. The Technical Paper Sessions are aligned according to technical topic areas associated with the IEEE EMC Society Technical Committees.The greatest number of papers received was in the topic area of EMC Measurements (TC2). Over 40 papers are … [Read more...]
EMC Society Technical Committees
What is a technical committee? The technical committees play an important role in the overall success of the EMC Society by promoting activities in their fields and providing expert knowledge and assistance to generate and review technical papers, to organize and operate sessions at symposia, to generate and develop standardsn and to evaluate the “state of the art” in EMC … [Read more...]
Special & Invited Sessions – Modeling/Simulation Validation Standards and Applying the FSV Technique to Quantify Validation Quality
This special session will focus on the recently published IEEE standard for model/ simulation validation. The Feature Selective Validation (FSV) technique is used to quantify the quality of the agreement between two data sets, such as the simulation results and the data used as validation data. The FSV techniques must be modified depending upon the use, and this session will … [Read more...]
Special & Invited Sessions – Spectrum Management: Evolving Trends
To address the growing number of spectrum related problems faced by EMC engineers and technologists, this Special Session will present methodologies and measurement techniques to both control and quantify the use of the spectrum. The objective of this session is twofold. The first objective is to present some of the latest research into the design of components, such as power … [Read more...]
Special & Invited Sessions – Multi-Gbps Interconnect Simulation and Measurement for Signal Integrity and EMI
Building accurate electrical models and predicting the interconnect performance are increasingly challenging for present and future high speed signaling where a few pico-seconds or mili-volts of error are no longer considered “negligible”. This Special Session will address this issue by focusing on multi-Gbps interconnect simulation and measurement for signal integrity and EMI … [Read more...]
Special & Invited Sessions – EMC in Asia
Over the last 10 years, economic development in Asia has increased dramatically. As a result of this growth, the need for EMC regulation and the development of certification schemes has received increased focus. This Special Session will address the present and future of EMC development in Asian countries. Attendees will be informed of the state of regulatory affairs for … [Read more...]
EMC 2009 Call for Demonstrations – Call for EMC Computer Modeling & Simulation Demonstrations
In this highly popular symposium event, fundamental EMC modeling approaches and simulation methods are illustrated through a series of interactive computer demonstrations. Various computational electromagnetic (CEM) modeling techniques will be demonstrated illustrating their application to simple canonical type problems in order to show how specific EMC problems can be solved. … [Read more...]
Plated Mesh Features Encapsulated Wires
The EMIgard™ Series of conductively plated, optical fine wire mesh for EMI/RFI shielding of electronic displays and enclosures is available from Dontech. This shielding mesh is manufactured in 304 stainless, copper, and custom alloys. Meshes are available from 50 to 250 openings per inch (opi) in standard sheet sizes of 22″ x 28″ or precut to a specific size. In a unique, … [Read more...]
- « Previous Page
- 1
- …
- 187
- 188
- 189
- 190
- 191
- …
- 212
- Next Page »