The FCC announced New Equipment Authorization Rules in the First Report and Order FCC 17-93 on July 13, 2017, and followed this on July 20 with a live webcast of a panel discussion featuring the FCC OET and lab division Chiefs providing details of the changes and answering manufacturer questions. Highlights of the First Report and Order This report and order streamlines … [Read more...]
About the Author
Onyekachi Ukeje-Eloagu graduated with Cum Laude honors from Morgan State University Baltimore Maryland in 2002 with a degree in electrical engineering and a focus on RF/Microwave propagation. After undergraduate studies, he spent a number of years as a product development engineer at Black & Decker (US) Inc. in Towson Maryland. In this role, he worked extensively in using simulation tools to evaluate and predict performance and electromagnetic emissions of universal motors, and eventually became Black & Decker’s in-house expert on EMI matters. Following this, he spent a number of years in EMC Test engineering roles at a couple of regulatory test labs including TUV SUD America before returning to product development. He has extensive experience in new product development & manufacturing and regulatory compliance, and having completed stints working on cutting edge technologies in the consumer and professional power tool development industry, regulatory compliance testing industry, and medical device technology industry, now serves in the consumer electronics industry as senior regulatory compliance engineer at Belkin International. He is also pursuing a Master’s degree in electrical engineering and management of technology from the University of Minnesota - Twin Cities. His technology interests are antennas/RF propagation and electromagnetic compatibility as it relates to networking and communications of wireless devices. He is a member of IEEE Technical Committee 12 - EMC for Emerging Wireless Technologies. Specialties: New product development and manufacturing processes, product testing, systems design and evaluation, electromagnetic interference and compatibility (EMI/EMC), High Frequency Structure Simulation (HFSS), RF/Microwave theory, Communication Systems, R&D, Failure and root cause analyses.