The 2016 IEEE International Symposium on Electromagnetic Compatibility, sponsored by the IEEE EMC Society, featuring an embedded Signal Integrity and Power Integrity conference. The IEEE EMC Symposium provides knowledge and tools that help engineers address electromagnetic environmental effects and electromagnetic compatibility. Stay abreast of current technologies, testing and engineering methods. Join us 25th-29th July 2016 in Ottawa, Canada as we bring compatibility to the capitol in a region known for technological enterprise and government research, making this an ideal location to discuss, exchange and collaborate with the EMC and SI/PI Communities.
There will be three areas of focus for this symposium.
The first is EMC for emerging technologies, which would include wireless EMC, RF interference, Smart Grid EMC, nano-materials and silicon photonics, and unmanned aircraft systems EMC.
The second is signal and power integrity, which will include high-speed channel characterization and modeling, signal/power integrity design and simulation, 3D IC design and 3D packaging, and measurement techniques (jitter, equalization, and BER).
The third is space EMC, which will include launch vehicles, on-orbit platforms, systems and networks, and design and mitigation for the space environment.
For more information and to register, click here.
