On August 28, 2013, Keith Armstrong will present a live webinar on “Basics: Grounding, Immunity, Overviews of Emissions and Immunity, and Crosstalk.”
This webinar – number 3 in a series of 3 – describes a simple, easy non-mathematical engineering understanding of the physical underpinning of electromagnetics.
Watch the first and second webinar in this series here.
This understanding leads directly to EMC design techniques that have been proven many times in real-life in many countries to easily:
- reduce time-to-market
- improve product functional performance (i.e. improve SI and PI)
- reduce cost of manufacture and so increase profitability
- reduce warranty costs
– and so save time and money overall whilst reducing financial risks.
Who should attend?
All electronic designers, including PCB designers, and their managers (who will easily be able to follow it).
What you can expect:
Practical no-nonsense understanding of some of the electrical/electronic underpinnings that are key to understanding EMC, Signal Integrity (SI) and Power Integrity (PI) design.
No jargon, plain English, hardly any mathematics.
With this non-mathematical understanding of the physics underpinning EMC, SI and PI – proven to be fully effective up to 26GHz (and in theory perfectly effective at frequencies up to infra-red) – it will be much easier to understand EMC design techniques, and decide which to use in any application, whether for modules or products (however small), equipment, systems or installations (however large).
