Intertronics, a producer of adhesives, has released Polytec EC 275, a paste-like adhesive, ideal for “IC packaging, connecting circuits to copper coils (RFIDs or smart cards) and EMI/RF shielding.”
“Polytec EC 275 utilizes nickel-free fillers not based on silver flake to create an electrically conductive performance appropriate for die attach, SMD bonding, RFID antennas, and EMI/RFI shielding applications,” Peter Swanson, Intertronics M.D., said.
The adhesive is available either as two components or premixed and frozen in syringes.
