TDK Corporation, a manufacturer of electronic components, modules and systems, has released a miniaturized multilayer chip bead series in case size 0603 (EIA 0201) ideal for eliminating noise in compact mobile devices, including data storage devices and smartphones that operate with multiple frequency bands.
Measuring 0.6 x 0.3 x 0.3 mm³ and featuring “excellent electrical characteristics,” the new MMZ0603-E series is “nearly 80 percent smaller in volume and 65 percent [smaller] in area than existing MMZ1005-E types with comparable performance.”
The MMZ0603-E series is currently available in two high-impedance versions—one rated for 600 ohms and the other rated for 1,000 ohms at 100MHz. Both versions also offer higher impedance values of 1,000 ohms and 1,800 ohms at 1 GHz.
