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Electrical Performance of Electronic Packaging and Systems Conference

Calendar

Title: Electrical Performance of Electronic Packaging and Systems Conference
Date: October 21 – 24 2012
Location: Tempe, AZ
Description: The IEEE Components, Packaging and Manufacturing Technology Society and the IEEE Microwave Theory and Techniques Society present the EPEPS conference on October 21-24, 2012 at the Tempe Mission Palms Hotel in Tempe, AZ. EPEPS is an international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. Other topics include new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. Technical papers relating to new contributions in the area of electrical performance of high-performance interconnect systems will be presented.
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Interference Technology

Established in 1970, Interference Technology helps EMI/EMC engineers find solutions to their various testing, design, application and regulatory issues by publishing articles, news and other practical content. We help suppliers in these areas to find the right customers for their components, materials, test equipment and services through a wide range of marketing services, including lead generation, branding, market research and events. The publication is available in various printed and electronic media formats, with readers in over 60 countries. We also publish issues in local languages in China, Japan and Europe.

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