According to new research, the switch from wired to wireless technology and the “emergence of a number of directive and regulations in favor of EMC shielding solutions drive the EMC shielding market.” Alternatively, the smaller scale of devices coupled with their complexity and high cost is said to slow the growth of the market. For revenue generation, Asia has the highest … [Read more...]
Shielding
- High Precision 3D-Laser Cutting Technology for RF Shield Modifications - Presented by Masach
- NextGen RF Shields 5G-Enabled, Online Catalog - Presented by Masach
- RF Shielding Tames RFI and EMI Emissions - Presented by Masach
- Making Repairs Possible with Two-Piece RF Shields - Presented by Masach
- Adding Mouse Holes To Standard RF Shield - Presented by Masach
EMI Microwave Absorber Application Note
Laird Technologies, Inc. has published a new application note, "Q-Zorb™ Microwave Absorbers for Collision Avoidance System Applications."The application note examines how with the rise of wireless electronics and the movement to higher frequencies, microwave absorbers or "noise suppression sheets" (NSS) are now used to reduce electromagnetic interference (EMI) inside collision … [Read more...]
EMC Business Bulletin – January 2012 – Volume 14
Who is Managing your Brand Image? Recently two partnering media companies, Vizu and Digiday, conducted a survey of approximately 450 brands, agencies, and publishers to assess the trends in online brand advertising. The results have just been published in a report entitled “Industry Survey: 2012 Brand Advertising Outlook and Best Practice Benchmarks.” Here are some of the … [Read more...]
Electric Potential: EMI Shielding in Electric Vehicle Applications
The growing challenge of preventing electromagnetic interference (EMI) is particularly acute in the automotive sector. Cars feature increasing numbers of electronic systems, often in close proximity because of packaging constraints. Information systems such as GPS receivers, entertainment systems such as DVD players, and convenience features such as reversing aid cameras all … [Read more...]
Expand Safe I/O with Modular Safety Controller
Phoenix Contact’s new modular safety controller makes it easy to expand I/O in a safety circuit. The PSR-TRISAFE/M (for modular) connects up to 10 safe digital I/O modules, thanks to a T-bus system. The TRISAFE/M’s base station has 20 safety input signals and four safety category 4 outputs. It also provides outputs for a test pulse, alarm (aux), and ground switching. The safe … [Read more...]
Miniaturized Central Office Splitter for xDSL Applications
Wurth Electronics Midcom Inc.’s new splitter module for xDSL central office DSLAM products measures 22mm x 13.7mm x 12.9mm. The splitter consists of integrated inductors, capacitors and resistors. The compact design and integrated components provide an overall reduction to customer bill of materials and board space. Further integration is available via an inclusion of a … [Read more...]
ESD-Protection IC for Ultra High-Speed Micro-SD Card Slots
STMicroelectronics’ new IC combines EMI filtering and Electro-Static Discharge (ESD) protection, offering features for equipment such as mobile phones, tablets and 3G dongles using SD 3.0 Ultra High Speed (UHS-I) micro-SD cards.The EMIF06-MSD03F3 features the most advanced, miniaturized package technology used for this type of device but allows either electrical or mechanical … [Read more...]
Designing Electronic Systems for EMC: Grounding for the Control of EMI
There are two primary reasons for grounding devices, cables, equipment, and systems. The first reason is to prevent shock and fire hazards in the event that an equipment frame or housing develops a high voltage due to lightning or an accidental breakdown of wiring or components. The second reason is to reduce EMI effects resulting from electromagnetic fields, common impedance, … [Read more...]
A Comparison between Gelatinous and Tacky Coated Type Packaging Carriers
Robert J. Vermillion, RMV Technology Group, LLC, NASA-Ames Research Center, Moffett Field, California USA; Doug Smith, DC Smith Consultants, Los Gatos, California, USA For years, semiconductor and aerospace engineers have fielded questions regarding the suitability of using gelatinous and tacky coated packaging materials for the distribution, storage, and sale of ESD sensitive … [Read more...]
Peak EMI Reduction Clock Generator
ON Semiconductor’s P3MS650103H device is a spread spectrum frequency modulator clock generator with 1.8V/2.5V/3.3V LVCMOS output designed specifically for clock frequencies between 15MHz and 60MHz. P3MS650103H reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The device allows significant system … [Read more...]
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