Electromagnetic simulation software provider WIPL-D has announced new versions of its WIPL-D Pro CAD 2013 and WIPL-D Pro v11 software, and will be offering information on the new products at the 2013 IEEE International Symposium on EMC. Designed for fast modeling and manipulation of electromagnetic applications, WIPL-D Pro CAD 2013 brings significant improvements in model … [Read more...]
Simulation Software Demo and New Consulting Services
Electro Magnetic Applications is offering information on a major software release and new consulting services at the 2013 IEEE International Symposium on EMC. Electro Magnetic Applications’ new simulation framework, EMA3D version 4, is currently available in beta with new features, including the ability to model large systems down to unprecedentedly-small ones. Symposium … [Read more...]
EM Propagation Software for Analysis of Wireless Communication Systems
Remcom, a provider of wireless propagation and EM simulation software, has released a new version of its electromagnetic propagation software for the analysis of site-specific radio propagation and wireless communication systems. According to the company, version 2.7 of Wireless InSite includes new capabilities related to statistical modeling of parameter uncertainty, as well … [Read more...]
Demonstration of EMC Systems and Solutions
EMC systems and solutions provider Teseq will be showcasing several products during the 2013 IEEE EMC Symposium. Representatives from Teseq will demonstrate the following products at booth No. 309 during the symposium: The DC-LISN-M2-100, a high current impedance stabilization network (LISN) for measuring conducted emissions disturbances on DC power ports of photovoltaic … [Read more...]
Test Platform Offers Complete Solution for Broadcast Equipment Testing
Rohde & Schwarz, a supplier of electronics solutions in a variety of industries, has released the new R&S BTC broadcast test center, a high-end test platform that offers a complete testing environment for nearly all audio, video and multimedia applications. Designed to assist chipset and receiver manufacturers with the development, certification and quality assurance … [Read more...]
New Three-Phase and Neutral Line Filters for High-Power Industrial Applications
EMC product manufacturer PREMO has announced the expansion of its series of high-performance three-phase and neutral line filters for high-power industrial applications. Designed with a low leakage current of <1mA, the FVNSB series of filters are now rated from 8 to 600A at 50°C and are available with a four-wire connection mode in a compact package with “touch safe” … [Read more...]
EMC Compliance, Spectrum Analysis and RF Test Tools Demonstration
Agilent Technologies, a provider of measurement tools and expertise, has announced that it will present some of its products at the 2013 IEEE International Symposium on Electromagnetic Compatibility, Aug. 5-9 at the Denver Convention Center in Denver, Colo. Agilent representatives will demonstrate the following: Full-compliance CISPR, MIL-STD and DO-160 EMI measurements made … [Read more...]
EMI Chip Filter Range Extended to Include 3A Device
Syfer Technology Ltd., a manufacturer of application-specific multilayer ceramic capacitors and EMI suppression filters, has announced that their E07 range of high-current three-terminal EMI chip filters has been extended to include a 3A device. Suitable for use on DC lines on PCBs, the E07 filters are designed to reduce electromagnetic interference emanating from high-speed … [Read more...]
Multilayer Chip Bead Inductors Address Signal Circuit Noise
Taiyo Yuden Co., Ltd., a developer of new technology for capacitors, inductors, circuit products, SAW/FBAR devices and energy devices, has announced the expansion of its component series of chip bead inductors designed to address the high frequency noise generated in the power supply and signal circuits of small mobile devices, including smartphones. The new releases include … [Read more...]
New MIL-DTL-38999-Style Connectors with Integrated EMI Filters
SOURIAU PA&E, a manufacturer of ceramic and metal components and assemblies, hermetic connectors and advanced hermetic electronic packaging, has added a new EMI filtered option for the company’s lightweight, high-performance MIL-DTL-38999-style connectors. Featuring aluminum or titanium shells and beryllium copper CDA alloy 172/173 pins for high electrical performance, the … [Read more...]
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