The drive to protect the environment and to conserve natural resources has brought about a proliferation of regulations. Tony Dibiase Spec-Hardened Systems, Rochester, NY, USA INTRODUCTION As the clamor for better and newer electronic products continues worldwide, there is increased concern over landfills accepting growing “mountains” of discarded electronic products. … [Read more...]
Ensuring Electromagnetic Compatibility (EMC)
The IEC coordinates a worldwide system for testing electrical equipment. International Electrotechnical Commission Geneva, Switzerland How does a hospital manager know that equipment such as a CAT scanner, when operating, will not affect nearby electromagnetic systems in the building, such as an X-ray machine, thereby potentially putting patients at risk? Since the early … [Read more...]
Test Beyond the Specs: Why Test Higher in Frequency and Field Strength?
IEC 61000-4-3: 2006's frequency escalation Jason Smith and Pat Malloy AR RF/Microwave Instrumentation, Souderton, PA, USA An increasing number of new and proposed EMC standards are pushing the upper frequency test limits higher into the microwave spectrum. The latest EMC standard released, IEC 61000-4-3: 2006, is no exception. The upper frequency test limit has been increased … [Read more...]
Don’t Settle for Being Just an E3 Engineer—Become an E3 Advocate!
INTRODUCTION It is often the accepted practice for the E3 engineer on a program simply to provide his technical expertise on meeting EMI, EMC, EMP and other E3 requirements and to let others take the recommendations from there. Once the analysis and recommendations are complete, the decisions on how to implement the design are up to the platform design team. The truth be … [Read more...]
Towards an EMC Technology Roadmap
A technology roadmap is a tool for attaining the optimum development within a sector of technology. Marcel van Doorn Philips Electromagnetics & Cooling Competence Center, Eindhoven, the Netherlands INTRODUCTION This article expands earlier work on the concept of a technology roadmap for EMC technology.1 Just as a traditional terrestrial map helps insure that travelers … [Read more...]
New EMC Directive: 2004/1081 EC
Manufacturers should familiarize themselves with the additional requirements and the alterations found in the new EMC directive Manjula Bhati Electronics Regional Test Laboratory (West), Indian Ministry of Information Technology, Mumbai, India The current EMC directive 89/336/EEC, which was first published in 1989 and then succeeded by four amendments has been rewritten as … [Read more...]
Voltage Sag Testing for Commercial and Industrial Equipment
The ultimate goal for any product manufacturer is to make its product immune to voltage sags. Andreas Eberhard, Power Standards Lab Alameda, CA Modern equipment can be sensitive to brief disturbances on the AC power mains. Unfortunately, electrical systems are subject to a wide variety of power quality problems that can result in interruption of the production process, damage … [Read more...]
An Emission Measurement System for the Twenty-First Century Based on Time-Domain Measuring Methods
More information and reduced measurement time can significantly improve the quality of emissions testing. Stephan Braun and Peter Russer Institute for High Frequency Engineering, Munich University of Technology, Munich, Germany For some time, measurements of electromagnetic interference have been carried out by super-heterodyne receivers operating in the frequency domain. … [Read more...]
Shielding Effectiveness of Gaskets, Composites and Shields
There is an ever-increasing demand for lighter, stronger, easy-to-manufacture and cost-effective shielding solutions. Jack Prawica and Jereme Irwin DLS Electronic Systems, Inc., Wheeling, IL, USA As we move into the 21st century, there is a demand for stronger, lighter, less expensive, and environmentally friendly, RoHS-compliant* conductive materials. Many industry insiders … [Read more...]
Thermal and EMI Shielding Boost Design Reliability
Optimal shielding helps meet the challenges of cramming maximum functionality into minimal PCB space. Paul J. Stus Laird Technologies, St. Louis, MO, USA Advances in the miniaturization of electronic components has intensified the need for manufacturers to solve multiple problems simultaneously and earlier in the design process. Solving the issues quickly and early in … [Read more...]
- « Previous Page
- 1
- …
- 62
- 63
- 64
- 65
- 66
- …
- 71
- Next Page »