Ironwood Electronics has introduced a series of high performance BGA socket for high speed probing of the memory chip and processor debugging during the design phase. This stacked socket can probe 1Gb memory devices using Agilent’s Flex Probe stacked inside the socket. Agilent’s probe makes contact with the target PCB through the 0.5mm thick high density elastomer contact. The memory chip sits on top of the Probe and makes contact with it through high speed elastomer contact as well. Agilent’s Probe brings out the signals to oscilloscope/logic analyzer for high speed probing.Learn more from Ironwood Electronics.
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Interference Technology
Established in 1970, Interference Technology helps EMI/EMC engineers find solutions to their various testing, design, application and regulatory issues by publishing articles, news and other practical content. We help suppliers in these areas to find the right customers for their components, materials, test equipment and services through a wide range of marketing services, including lead generation, branding, market research and events. The publication is available in various printed and electronic media formats, with readers in over 60 countries. We also publish issues in local languages in China, Japan and Europe.