Ironwood Electronics has introduced a series of high performance BGA socket for high speed probing of the memory chip and processor debugging during the design phase. This stacked socket can probe 1Gb memory devices using Agilent’s Flex Probe stacked inside the socket. Agilent’s probe makes contact with the target PCB through the 0.5mm thick high density elastomer contact. The memory chip sits on top of the Probe and makes contact with it through high speed elastomer contact as well. Agilent’s Probe brings out the signals to oscilloscope/logic analyzer for high speed probing.Learn more from Ironwood Electronics.
BGA Socket Series for High Speed Probing
