Wireless telecom provider, NextWave Wireless, Inc. recently announced that it has retained Deutsche Bank and UBS Investment Bank to explore the sale of its extensive spectrum holdings in the United States. NextWave's U.S. footprint covers more than 251 million people in the United States and includes major markets such as New York, Los Angeles, Chicago, San Francisco, Boston, … [Read more...]
Triple-Output Stepdown Switching Regulator IC Uses Multiphase Switching to Reduce EMI
A new triple-output stepdown switching regulator IC, featuring three high-current outputs that are adjustable from 0.8 V to 5 V with a maximum current of 2 amps, has been introduced by Allegro Microsystems. Operating from an input voltage of 4.5 V to 34 V, the A4490 uses multiphase switching to reduce EMI and to minimize stress on the input capacitors by interleaving the … [Read more...]
Chip Ferrite Beads Provide Effective EMI Suppression
The BLM Series of chip ferrite beads from MuRata Manufacturing has been crafted to function nearly as a resistor at noise frequencies--a characteristic that greatly reduces the possibility of resonance and leaves signal waveforms undistorted. This series is effective in circuits without stable ground lines because it does not need a connection to ground. The nickel barrier … [Read more...]
Miniature Filter Arrays Target Handset Applications
A new family of EMI filter arrays from OnChip Devices comes with onboard ESD protection in various TDFN and uDFN package options. Crafted specifically for high-speed data interfaces in mobile phone, the EMF110x family is offered in 4-channel, 6-channel, and 8-channel filter arrays. They are reported to deliver excellent S21 characteristics with extremely low parasitic … [Read more...]
Catalog Details Wide Line of Shielding Products
A new catalog from Tech-Etch details the company's EMI/RFI shielding product line, including all sizes, shapes, compositions, mounting options, and seal types. This 52-page catalog features to-scale technical drawings, compression values, and metal thicknesses for over 100 BeCu and stainless steel finger stock shielding profiles--including low gasket profiles; soft no-snag … [Read more...]
Spread Spectrum IC Reduces EMI in USB Applications
A USB 2.0 Peak EMI Reduction IC from PulseCore Semiconductor uses spread spectrum technology to achieve compliance in USB applications. The PCS3P73U00A is based on patent-pending technology and is said to simplify EMI reduction while reducing or eliminating the need for expensive metal shielding, ferrite beads, conductive paint, or filtering networks. Spread spectrum clocking … [Read more...]
ISO Amended Standard: Road Vehicles & Electrical Disturbance
The International Standards Organization has published ISO 7837-1 Amd 1: 2008 entitled "Road vehicles - Electrical Disturbance by conduction and coupling - Part 2: Commercial vehicles with nominal 24-V supply voltage - Electrical transient conduction along supply lines only - Amendment 1. This new publication amends ISO 7637-2: 2004. For more information, or to purchase this … [Read more...]
IEC Issues Three New EMC Standards on MV, HV, and EHV Power Supplies
The International Electrotechnical Commission (IEC) has issued three new standards on electromagnetic compatibility-specifically IEC 61000-3-6 Ed. 2.0; IEC 61000-3-7 Ed. 2.0; and IEC 61000-3-13 Ed. 1.0. All deal with the assessment of emission limits. The first 6100-3-6 is a technical report, informative in nature that provides guidance on principles that can be used as the … [Read more...]
Solving the Galvanic Corrosion Issue in EMI Shielding
Tungsten carbide/aluminum composite particles inhibit galvanic corrosion of aluminum. An on-going issue in the design of reliable EMC shielding is galvanic corrosion of aluminum. How can an aluminum frame be protected from galvanic corrosion if it contacts an EMI gasket containing non-aluminum particles? Chromate conversion coatings have long been used to reduce the corrosion … [Read more...]
Off-Chip Decoupling Measures: The EMC Perspective
Off-chip decoupling, or buffering, is a necessity. Over the years, many papers and articles have been written about optimizing off -chip IC decoupling. Many IC vendor application recommendations feature a cluster of decoupling capacitors adjacent to the IC, in close proximity to one another—viz. an electrolytic capacitor along with a small and a large value ceramic capacitor … [Read more...]
- « Previous Page
- 1
- …
- 637
- 638
- 639
- 640
- 641
- …
- 650
- Next Page »
