Vishay Intertechnoglogy Inc., a manufacturer of semiconductors, has announced new enhancements to their PowerPAK package. Researchers note this is a new “family of VRPower® integrated DrMOS power stage solutions in the low-profile, thermally enhanced PowerPAK® MLP 5 mm by 5 mm 31-pin package.”
The company’s devices are now about 30 percent smaller and said to increase efficiency and high currents. Also, “with reduced package parasitics compared to discrete solutions, the devices enable high switching frequencies to 1.5 MHz for increased power density and lower overall solution costs.” These new enhancements also enable operation in cooler environments, include thermal warning features, and allow higher efficiency in projects.
