The U.S. Patent and Trademark Office has issued patent no. 8349659, titled “Integrated Shield for a No-Lead Semiconductor Device Package.”
According to background information supplied by the inventors, “there is a need for an electromagnetic shield that is inexpensive to manufacture on a large scale, does not waste space around the semiconductor device package, and effectively deals with EMI concerns.”
In the summary information for the patent, the inventors stated, “the present invention integrates a shield on a flat, no-lead (FN) semiconductor device package, which has multiple rows of contact pads along any given side … The inner and outer rows of contact pads and a die attach pad form the foundation for the FN semiconductor device package.”
