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november, 2019

04nov(nov 4)1:00 am06(nov 6)1:00 amIEEE COMCAS 2019

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Event Details

Welcome to COMCAS 2019

COMCAS 2019 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in areas such as communications, antennas, radar, RF and microwave circuits and systems, and biomedical engineering.

Following the previous COMCAS conferences, we expect more than 1500 participants from about 40 countries around the world.

IEEE COMCAS 2019 will deal with issues including Innovations in Technology, Digital AESA Radar, Intuitive Microwave Filter Design with EM Simulation, Space Oriented technology, Thermal Management, 5G and “Internet of Things” communications.

We welcome the IEEE Electronic Packaging Society (EPS) to COMCAS 2019 and thank them for providing a Packaging and Thermal Management program Track, which addresses issues of critical interest to the electronics industry, such as Design & Reliability, Heterogeneous Integration, WLP, Flip Chip, new Materials & Processes, and an in-depth exploration of thermal management challenges and opportunities.

www.comcas.org

Time

4 (Monday) 1:00 am - 6 (Wednesday) 1:00 am

Location

David Intercontinental Hotel

Tel Aviv, Israel

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