Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last year’s success, the Committee is looking forward to the 23rd Edition which will convene in the French Alps, in the charming town of Chambery, on the shores of the Bourget lake. The SPI2019 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore. On this web site you can find all information regarding the 23rd IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in France!